BrewerBOND® 701 Material

Laser Release Material
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The need for UV laser technology options within the packaging realm is ever evolving. The introduction of Brewer Science’s first-generation UV laser release material was designed to benefit a variety of temporary bonding and debonding market applications including chip-first/chip-last and RDL-first FOWLP processes.

Laser Release System

BrewerBOND® 701 material is the most versatile laser release material due to its ability to handle a variety of stress applications. Its typical thickness is 150-250 nm, and the material is thermally stable up to 400°C. The material is used with a transparent carrier and can be debonded at laser wavelength ranges of 248 nm to 355 nm. BrewerBOND® 701 material can be removed with solvent prior to cure for rework. When using the laser debond process, this material is suitable for all production environments due to its high throughput and low-stress separation.

Market Sector

  • Silicon interposer as bridge technology to initiate 3-D packaging
  • eWLB (FIWLP & FOWLP)
  • Memory
  • Compound semiconductor

Benefits

  • Compatibility with various wavelengths (e.g. excimer, solid state, and others)
  • Enables low-stress separation from carrier at room temperature
  • Enables alternative processes including selective debonding when used with other release layers
  • Enables rapid debonding laser equipment
  • Limited thermal contribution because it works with either solid state or excimer laser at lower wavelengths

The laser release maximum throughput makes it a good choice for high-volume production goals. This method works for all production environments.

Laser Release Method

Distinctive characteristics of the laser release method:

Cleaning

*Coating can be removed by an oxidizing plasma or an oxidizing solvent stripping process such as ozone plasma stripping, Piranha solution, or RCA cleaning.

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BrewerBOND® 701 Material

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