Mechanical Debonding Release Material

BrewerBOND® 530 Material

The introduction of BrewerBOND® 530 mechanical debonding release material offers additional choices for stronger adhesions necessary for high stress/high temperature temporary bonding applications.

 = Selected
 = Debond Method
 = Recommended
 = Thermal Stability
 = Locked
 = Backside Process
Carrier Rework
eWLB
PGMEA Resistant
High Vacuum CVD/PVD
CVD/PVD
Grind to 30μm
Grind to 50μm
Grind to 100μm
< 200°C
200-250°C
250-300°C
> 300°C
Laser
Chemical
Release
Thermal
Slide
Mechanical

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  • Click on a debond method
  • Click on a thermal stability
  • Click on a backside process

BrewerBOND® 530 material is a mechanical debonding release material that has been specifically designed for maximum performance with all of the temporary adhesives utilized for mechanical release. It is compatible with all external equipment manufacturers and mechanical release systems.

Mechanical Release Illustration

Specific Market Segments

  • FOWLP
  • 3DIC
  • Power

Why BrewerBOND® 530 material?

BrewerBOND® 530 material offers to our customers and partners the capability of easy rework/reuse of carrier wafers as it is solvent removable. This material is compatible with the entire adhesive portfolio offering by Brewer Science for temporary bonding and debonding.

Mechanical Debonding Release Material Benefits

  • Compatible with 250°C - 300°C bonding materials
  • Simple application on carrier substrate
  • Lower cost of ownership with carrier substrate reuse
  • Carrier substrate rework by solvent clean, RCA clean, or
    ash
  • Low-force separation

Mechanical Release Layer Compatibility

BrewerBOND® 530 material is most compatible with the following Brewer Science Bonding Materials: