BrewerBOND® 510 Material

Release Material for Mechanical Debonding
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Temporary wafer bonding release material for mechanical debonding applications.

BrewerBOND® 510 material is applied to a carrier using a simple process and is compatible with ≤ 300°C bonding materials. After processing, a low-force separation is used to debond, and the carrier could potentially be reused. Because the carrier may be reused (depending on metallization processes), this material has a lower cost of ownership than other options, making it ideal for entry into the wafer-bonding space or for projects with smaller throughput requirements.

Key Market Sectors

  • 3-D wafer-level packaging
  • MEMS
  • Compound semiconductor

Benefits

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BrewerBOND® 510 Material

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