Wafer-Level Packaging

Our proven temporary wafer bonding systems are designed to fit into a variety of process scenarios with minimal disruption. We offer exclusive material and equipment sets for low-volume R&D environments, and we work with leading equipment vendors to provide fully automated solutions for higher-volume needs.

Brewer Science was one of the first companies to recognize the potential of temporary wafer bonding for ultrathin wafer handling. Connect with one of our experts today to see how we can optimize your ultrathin wafer handling process.

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