Wafer-Level Packaging
Our proven temporary wafer bonding systems are designed to fit into a variety of process scenarios with minimal disruption. We offer exclusive material and equipment sets for low-volume R&D environments, and we work with leading equipment vendors to provide fully automated solutions for higher-volume needs.
Brewer Science was one of the first companies to recognize the potential of temporary wafer bonding for ultrathin wafer handling. Connect with one of our experts today to see how we can optimize your ultrathin wafer handling process.
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BrewerBOND® 530 mechanical debonding release material offers additional choices for stronger adhesions necessary for high stress/high temperature temporary bonding applications.
BrewerBOND® 220 temporary wafer bonding material is an organic coating that enables back-end-of-line (BEOL) processing of ultrathin wafers using standard semiconductor equipment.
Temporary wafer bonding release material for mechanical debonding applications
This UV laser release material was designed to benefit a variety of temporary bonding, debonding market applications including chip-first/chip-last and RDL-first FOWLP processes.
WaferBOND® HT-10.10 temporary bonding material enables back-end-of-line (BEOL) processing of ultrathin wafers with standard semiconductor equipment
WaferBOND® CR-200 temporary bonding material enables back-end- of-line processing of ultrathin wafers with standard semiconductor equipment
BrewerBOND® 305 temporary wafer bonding material is an organic coating that enables back-end-of-line (BEOL) processing of ultrathin wafers using standard semiconductor equipment.