June 05, 2018
Innovation. Diversity. Empowerment. At Brewer Science, we continue to push the mold. We are doers, thinkers and creators, working together to achieve success for ourselves, our organization and our customers. As a global leader in the semiconductor industry, we are committed to building real change and enriching lives.
September 07, 2017
Learning more about our debonding technologies.
May 31, 2017
How Temporary Bonding Works Learn how temporary bonding and ultra-thin wafers are being used to create smaller and faster electronic devices. Check out our temporary bonding materials here
April 06, 2017
InFlect™ moisture sensors utilize our revolutionary carbon-based nanotechnology to deliver highly sensitive and real time response to small changes in moisture and are ideal for monitoring low-humidity environments.
March 21, 2017
Directed self-assembly (DSA) is an exciting new technology that uses specially designed block copolymers to form IC patterns on a molecular scale.
March 07, 2017
Understanding Panel-Level Processing Ram Trichur explains how the transition from conventional wafers to large panels can generate significant cost savings for fan-out wafer-level packaging, and how these large, thin panels pose new challenges for handling and processing. Learn more about our Wafer-Level Packaging developments here.
March 03, 2017
Brewer Science Inflect™ Flex Sensor InFlect™ flex sensors utilize our revolutionary carbon-based nanotechnology to deliver a highly sensitive and real-time response to varying angles of deflection.
February 06, 2017
Multilayer technology from Brewer Science has allowed the industry to continue to push the limits of advanced lithography well into the future. Our experts explain why it was needed and how it eventually became the industry standard for leading-edge semiconductor manufacturing.
February 02, 2017
ProTEK® Materials Highly oleophobic and hydrophobic transparent scratch-resistant coating.
February 01, 2017
Why do we need temporary bonding technology? Ram Trichur is back to discuss how temporary wafer bonding technology allows IC manufacturers to safely handle ultra-thin wafers during advanced processing and packaging steps. Thinning the wafers before the chips are packaged allows for thinner electronic devices and overall better performance Check out our temporary bonding materials…