Wax Materials vs Brewer Science Thermal Slide Technology

The New Standard in Thermal Slide Technology

  • Lower cost of ownership through increased throughput, decreased rework, wider process capabilities, and maximized device yield
  • Improved via uniformity and increased die yield across substrate
  • Rheology designed for maximum device support during extreme thermal backside processing
  • Ability to safely handle thinned device wafers through debonding and cleaning


Complete the form below to download the presentation: