IEEE Electronic Components and Technology Conference
May 30-June 2, 2017
Lake Buena Vista, Florida
Wednesday, May 31, 8:00-11:40 a.m.
Session 1: Fan-Out Packaging Process and Integration
10:50 AM – Process Development and Material Characteristics of TSV-Less Interconnection Technology for FOWLP
Wen-Wei Shen, Yu-Min Lin, Sheng-Tsai Wu, Hsiang-Hung Chang, Tao-Chih Chang, and Ang-Ying Lin – ITRI; Alvin Lee, Jay Su, and Baron Huang – Brewer Science; Kuan-Neng Chen Chen – NCTU
Thursday, June 1, 8:00-11:40 a.m.
Session 16: 3D Materials and Processing
10:00 AM – Advances in Thin Wafer Debonding and Ultrathin 28-nm FinFET Substrate Transfer
Alain Phommahaxay, Anne Jourdain, Goedele Potoms, Greet Verbinnen, Erik Sleeckx, and Eric Beyne – IMEC; Alice Guerrero, Dongshun Bai, Kim Yess, and Kim Arnold – Brewer Science
Thursday, June 1, 1:30-5:10 p.m.
Session 19: Recent Advances in FOWLP Technology
3:30 PM – Temporary Bonding and Debonding Technologies for Fan-Out Wafer-Level Packaging
Qi Wu, Xiao Liu, Kuo Han, Dongshun Bai, and Tony Flaim – Brewer Science
Session 33: Advanced Bonding and Soldering Technology
Committee: Materials & Processing
Kimberly Yess – Brewer Science
Qianwen Chen – IBM Corporation
Brewer Science will be showcasing their next generation Temporary Bonding Systems at ECTC.
Schedule a time to meet at the conference or ask a question: